
Statistics
Geometry range | 2.4 – 0.35 µm |
Processes | Low, Medium & High Voltage CMOS and BCD |
Mask layer/week | ~100,000 |
Wafer size | 6” and 8”(future) |
Cleanroom | Class 1 @0.1um |
Cleanroom area | 4300 m2 |
Potential cleanroom expansion | 1600 m2 |
Geometry range | 2.4 – 0.35 µm |
Processes | Low, Medium & High Voltage CMOS and BCD |
Mask layer/week | ~100,000 |
Wafer size | 6” and 8”(future) |
Cleanroom | Class 1 @0.1um |
Cleanroom area | 4300 m2 |
Potential cleanroom expansion | 1600 m2 |
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