Statistics
| Geometry range | 2.4 – 0.35 µm |
| Processes | Low, Medium & High Voltage CMOS and BCD |
| Mask layer/week | ~100,000 |
| Wafer size | 6” and 8”(future) |
| Cleanroom | Class 1 @0.1um |
| Cleanroom area | 4300 m2 |
| Potential cleanroom expansion | 1600 m2 |
Factsheet
| Geometry range | 2.4 – 0.35 µm |
| Processes | Low, Medium & High Voltage CMOS and BCD |
| Mask layer/week | ~100,000 |
| Wafer size | 6” and 8”(future) |
| Cleanroom | Class 1 @0.1um |
| Cleanroom area | 4300 m2 |
| Potential cleanroom expansion | 1600 m2 |